Kusiyana pakati pa zojambulazo za mkuwa (RA copper zojambulazo) ndi zojambula zamkuwa za electrolytic (ED copper zojambulazo)

Chojambula chamkuwandichinthu chofunikira popanga ma board board chifukwa chimakhala ndi ntchito zambiri monga kulumikizana, kuwongolera, kutulutsa kutentha, ndi chitetezo chamagetsi. Kufunika kwake kumadziwikiratu. Lero ndikufotokozerani zaadagulung'undisa mkuwa zojambulazo(RA) ndi Kusiyana pakatielectrolytic mkuwa zojambulazo(ED) ndi gulu la zojambula zamkuwa za PCB.

 

Chojambula chamkuwa cha PCBndi zinthu conductive ntchito kulumikiza zigawo zamagetsi pa matabwa dera. Malinga ndi kupanga ndi magwiridwe antchito, zojambula zamkuwa za PCB zitha kugawidwa m'magulu awiri: zojambulazo zamkuwa (RA) ndi zojambulazo zamkuwa za electrolytic (ED).

Chojambula chamkuwa chokulungidwa chimapangidwa ndi zosoweka zamkuwa zoyera kudzera mukugudubuza kosalekeza ndi kukanikiza. Lili ndi malo osalala, otsika roughness ndi wabwino madutsidwe magetsi, ndipo ndi oyenera kufala kwapamwamba-pafupipafupi chizindikiro. Komabe, mtengo wa zojambula zamkuwa zokulungidwa ndizokwera kwambiri ndipo makulidwe ake ndi ochepa, nthawi zambiri amakhala pakati pa 9-105 µm.

 

Electrolytic copper zojambulazo zimapezedwa ndi electrolytic deposition processing pa mbale yamkuwa. Mbali imodzi ndi yosalala ndipo mbali ina ndi yowawa. Mbali yaukali imamangiriridwa ku gawo lapansi, pomwe mbali yosalala imagwiritsidwa ntchito pa electroplating kapena etching. Ubwino wa zojambula zamkuwa za electrolytic ndi mtengo wake wotsika komanso makulidwe osiyanasiyana, nthawi zambiri pakati pa 5-400 µm. Komabe, kuuma kwake pamtunda ndikwambiri ndipo mphamvu yake yamagetsi ndi yosauka, zomwe zimapangitsa kuti zikhale zosayenera kutumizira ma signal apamwamba.

Gulu la zojambula zamkuwa za PCB

 

Komanso, malinga ndi roughness electrolytic mkuwa zojambulazo, zikhoza kugawidwa mu mitundu iyi:

 

HTE(High Temperature Elongation): Chojambula chamkuwa chotalikirapo kwambiri, chomwe chimagwiritsidwa ntchito makamaka m'mabwalo ozungulira amitundu ingapo, chimakhala ndi kutentha kwapamwamba komanso mphamvu yomangirira, ndipo kuuma kwake nthawi zambiri kumakhala pakati pa 4-8 µm.

 

RTF(Reverse Treat Foil): Bwezerani chojambula chamkuwa, powonjezera zokutira zinazake za utomoni kumbali yosalala ya chojambula chamkuwa cha electrolytic kuti muwongolere zomatira ndikuchepetsa kukhwimitsa. Kukula kwake kumakhala pakati pa 2-4 µm.

 

ULP(Ultra Low Profile): Chojambula chamkuwa chotsika kwambiri, chopangidwa pogwiritsa ntchito njira yapadera ya electrolytic, chimakhala ndi roughness yotsika kwambiri ndipo ndi yoyenera kufalitsa ma siginecha othamanga kwambiri. Kukhwimitsa nthawi zambiri kumakhala pakati pa 1-2 µm.

 

Mtengo wa HVLP(High Velocity Low Profile): Chojambula chamkuwa chothamanga kwambiri. Kutengera ULP, imapangidwa ndikuwonjezera liwiro la electrolysis. Imakhala ndi kuuma kwapang'onopang'ono komanso kuchita bwino kwambiri. Kukula kwake kumakhala pakati pa 0.5-1 µm. .